RT Journal Article
A1 Xianxun Yao
A1 Guolin Sun

PB iet
T1 Wideband horn antenna based on multi-substrate layer technology
JN Electronics Letters
VO 55
IS 1
SP 5
OP 6
AB A metal horn antenna fed by a co-planner waveguide with ground (CPWG) is designed and fabricated. To integrate and connect other active elements of the system, the CPWG is designed by multi-substrate PCB technology. A transition in the PCB layer concatenating the CPWG and the microstrip line has provided a continuous structure to lead the electric field from RF circuit into the horn. A ridge waveguide is used to widen the bandwidth. The simulated and measured results show that the proposed antenna has a broad impedance bandwidth of 33.1% (from 20.5 to 28.6 GHz) for |S 11|<–10 dB and the radiation patterns also satisfy the requirements over the bandwidth.
K1 radiation patterns
K1 wideband horn antenna
K1 PCB layer
K1 multisubstrate PCB technology
K1 continuous structure
K1 electric field
K1 metal horn antenna
K1 frequency 20.5 GHz to 28.6 GHz
K1 multisubstrate layer technology
K1 ridge waveguide
K1 active elements
K1 RF circuit
K1 microstrip line
K1 coplanner waveguide with ground
K1 CPWG
K1 broad impedance bandwidth
DO https://doi.org/10.1049/el.2018.6399
UL https://digital-library.theiet.org/;jsessionid=269qx4nbal4sq.x-iet-live-01content/journals/10.1049/el.2018.6399
LA English
SN 0013-5194
YR 2019
OL EN