@ARTICLE{ iet:/content/journals/10.1049/el.2018.6399, author = {Xianxun Yao}, author = {Guolin Sun}, keywords = {radiation patterns;wideband horn antenna;PCB layer;multisubstrate PCB technology;continuous structure;electric field;metal horn antenna;frequency 20.5 GHz to 28.6 GHz;multisubstrate layer technology;ridge waveguide;active elements;RF circuit;microstrip line;coplanner waveguide with ground;CPWG;broad impedance bandwidth;}, ISSN = {0013-5194}, language = {English}, abstract = {A metal horn antenna fed by a co-planner waveguide with ground (CPWG) is designed and fabricated. To integrate and connect other active elements of the system, the CPWG is designed by multi-substrate PCB technology. A transition in the PCB layer concatenating the CPWG and the microstrip line has provided a continuous structure to lead the electric field from RF circuit into the horn. A ridge waveguide is used to widen the bandwidth. The simulated and measured results show that the proposed antenna has a broad impedance bandwidth of 33.1% (from 20.5 to 28.6 GHz) for |S 11|<–10 dB and the radiation patterns also satisfy the requirements over the bandwidth.}, title = {Wideband horn antenna based on multi-substrate layer technology}, journal = {Electronics Letters}, issue = {1}, volume = {55}, year = {2019}, month = {January}, pages = {5-6(1)}, publisher ={Institution of Engineering and Technology}, copyright = {© The Institution of Engineering and Technology}, url = {https://digital-library.theiet.org/;jsessionid=978klpg04ha3c.x-iet-live-01content/journals/10.1049/el.2018.6399} }