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Athermal silicon optical interposers with quantum dot lasers operating from 25 to 125°C

Athermal silicon optical interposers with quantum dot lasers operating from 25 to 125°C

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Interposers for inter-chip interconnects should perform stably under high-temperature conditions and rapid temperature change due to the heat generated by mounted large-scale integration (LSI) chips. Athermal silicon optical interposers integrated with quantum dot lasers and other temperature-insensitive components on a single silicon substrate are demonstrated, and error-free data links at 12.5 Gbit/s operating from 25 to 125°C are achieved without any bias adjustment. Since maximum junction temperatures in most LSIs have been below 125°C now and will be in the future, the interposers are tolerant of heat generated by LSIs, and are suitable for inter-chip interconnects.

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      • 6. International Technology Roadmap for Semiconductors: 2012 Edition, Assembly and Packaging, Table AP2 and AP4. Available at http://www.itrs.net/Links/2012ITRS/2012Tables/AssemblyPkg_2012Tables.xlsx, accessed June 2013.
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