© The Institution of Engineering and Technology
A novel microelectromechanical system capacitive pressure sensor with two wings, which amplify the mechanical deformation of the pressure sensing diaphragm and increase the sensor's sensitivity, is presented. This seesaw structure is available for both single and differential capacitive pressure sensors. To verify this design, a single capacitive pressure sensor is manufactured based on silicon on a insulator (SOI) wafer. The test result shows that this pressure sensor has a sensitivity of 7.75 fF/kPa.
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3. Zhang, Y., Howver, R., Gogoi, B., Yazdi, N.: ‘A high-sensitive ultra-thin MEMS capacitive pressure sensor’. Int. Solid-State Sensors, Actuators and Microsystems Conf., TRANSDUCERS'11, Beijing, China, June 2011, pp. 112–115, .
http://iet.metastore.ingenta.com/content/journals/10.1049/el.2013.4170
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