Experimental evaluation of flexible high-speed interconnect system using substrate integrated waveguide technology

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© The Institution of Engineering and Technology
Published 14/11/2012

Abstract

A hybrid substrate integrated waveguide (SIW) interconnect composed of a baseband and a bandpass structure sharing the same physical area is implemented using a flexible substrate. This interconnect, which is aimed for chip-to-chip ultra-high-speed multichannel data communication, has been studied by measuring its S-parameters and time domain system performance. The fabricated hybrid SIW was subjected to various bending angles and the impact on signal integrity was observed by monitoring the output eye diagrams as well as reflection and transmission coefficients. System performance was measured with the data rate of 3.125 Gbit/s channel for both baseband and bandpass channels, which shows excellent quality eye diagrams for each channel.

Inspec keywords: time-domain analysis; data communication; substrate integrated waveguides; flexible electronics; S-parameters; integrated circuit interconnections

Other keywords: bending angles; substrate integrated waveguide technology; S-parameters; baseband structure; flexible substrate; bandpass structure; transmission coefficients; chip-to-chip ultra-high-speed multichannel data communication; reflection coefficients; signal integrity; hybrid substrate integrated waveguide interconnect; time domain system; flexible high-speed interconnect system

Subjects: Mathematical analysis; Waveguides and microwave transmission lines; Metallisation and interconnection technology

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