Intra- and inter-temperature measurement BIST for SiP module using digital frequency analyser circuit

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Intra- and inter-temperature measurement BIST for SiP module using digital frequency analyser circuit

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Published

A method and a novel circuitry for intra- and inter-chip temperature measurement in a system in a package (SiP) module is presented. The proposed built-in self-test (BiST) system for the SiP module features a newly proposed digital frequency analyser (DFA) that can be used to efficiently discern clock period differences of up to 1 ns. The full digital interface of the DFA enables power and area efficient temperature measurements in an SiP.

Inspec keywords: built-in self test; temperature measurement; system-in-package

Other keywords: ntra-temperature measurement; digital frequency analyser; system in a package; inter-temperature measurement; built-in self-test

Subjects: Semiconductor integrated circuit design, layout, modelling and testing; Product packaging; Thermal variables measurement

References

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      • Kim, C.K., Kong, B.S., Lee, C.G., Jun, Y.H.: `CMOS temperature sensor with ring oscillator for mobile DRAM self-refresh control', IEEE Int. Symp. on Circuits and Systems, 2008, Seattle, WA, USA, p. 3094–3097.
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      • P. Chen . A time-to-digital-converter-based CMOS smart temperature sensor. IEEE J. Solid-State Circuits , 8 , 1642 - 1648
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