Appendix 10: Laser packaging

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Appendix 10: Laser packaging

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Distributed Feedback Semiconductor Lasers — Recommend this title to your library

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Author(s): John Carroll ; James Whiteaway ; Dick Plumb
Source: Distributed Feedback Semiconductor Lasers,1998
Publication date January 1998

Laser optoelectronic packaging of DFB-laser chips is reported. Thermal properties, laser monitoring by photodiode, package-related backreflection and fiber coupling is presented.

Inspec keywords: optical fibre couplers; semiconductor lasers; fibre lasers; photodiodes; integrated optoelectronics; distributed feedback lasers

Other keywords: fiber coupling; optoelectronic packaging; photodiode; DFB-laser chips; package-related backreflection; thermal properties

Subjects: Lasing action in semiconductors

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Appendix 10: Laser packaging, Page 1 of 2

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