This chapter presents an investigation of design and manufacturing practices on the reliability of electronic devices, circuits and systems, with a strong focus on monitoring techniques to estimate the impact of these practices. Reliability models of these devices and systems have generally relied heavily on statistical data collected over a long period of time and codified into standards by various governments, technical agencies and companies. While new approaches to reliability analysis and modelling are emerging, some standards are still widely applicable. However, they barely cover new generations of devices designed and manufactured with new techniques such as ASIC designs, quick prototyping using array technologies, ever-changing semiconductor manufacturing methods, new packaging procedures, etc.
Dynamic reliability of systems, Page 1 of 2
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