Inspec keywords: germanium compounds; current density; annealing; arsenic compounds; switching circuits; tellurium compounds

Other keywords: low-frequency noise property; current density; AsTeGeSiN; trap density; annealing temperature; high-density 3D memory technology; high-density three-dimensional memory technology; stacking method; pulse cycling degradation; downscaling threshold switching device

Subjects: Memory circuits; Annealing processes in semiconductor technology; Semiconductor storage