Inspec keywords: microfabrication; silicon; surface morphology; crystal orientation; crystal defects; crystal microstructure; fracture toughness; tensile strength

Other keywords: surface orientations; (100) silicon microstructures; silicon-on-insulator wafers; pit-like defects; crystallographic orientation effect; high-strength structures; average strength; tensile fractures; bottom surfaces; tensile testing; (110) silicon microstructures; size 5 mum; Si; SOI bonding processes; intrinsic SOI defects; pressure 3.62 GPa to 3.14 GPa; surface morphology

Subjects: Fatigue, brittleness, fracture, and cracks; Solid surface structure; Deformation and plasticity; Fatigue, embrittlement, and fracture; Microstructure; Defects in crystals; Deformation, plasticity and creep